RAM cluster-type sputtering deposition device
There are five expansion slots, allowing for additional installations such as sputter chambers, deposition devices, and glove boxes.
The RAM cluster sputtering system is a cluster-type sputtering device equipped with RAM cathodes (four-sided low-damage sputtering cathodes). To avoid damaging the underlying layer, the initial layer is deposited using low-damage sputtering with the RAM cathode. It has five expansion slots, allowing for the addition of sputtering chambers, deposition devices, glove boxes, and more. Additionally, it is equipped with a 25-stage multi-tiered load lock, enabling the automatic deposition of a wide variety of deposition recipes for each slot, making it suitable for all kinds of research and development.
